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英***Oxford OpAL ® 開(kāi)放式樣品載入ALD設備

緊湊型開(kāi)放式樣品載入原子層沉積（ALD）系統

OpAL提供了專(zhuān)業(yè)的熱ALD設備，可以簡(jiǎn)單明了的升***使用等離子體，使得在同***緊湊設備中集成了等離子體和熱ALD。

· 開(kāi)放式樣品載入熱ALD，集成等離子體技術(shù)

· 現場(chǎng)升***到可使用等離子體

· 從小晶片到200mm大晶片

適用于學(xué)術(shù)、產(chǎn)業(yè)、研發(fā)的熱和/或等離子體化學(xué)產(chǎn)品，可用于：

氧化物： HfO2, Al2O3, TiO2, SiO2, ZnO, Ta2O5
氮化物：TiN, Si3N4
金屬： Ru, Pt

ALD應用舉例：

· 納米電子學(xué)

· 高k柵極氧化物

· 存儲電容器絕緣層-銅連線(xiàn)間的高縱橫比擴散勢壘區

· 有機發(fā)光二極管和聚合物的無(wú)針孔鈍化層

· 鈍化晶體硅太陽(yáng)能電池

· 應用于微流體和MEMS的高保形涂層

· 納米孔結構的涂層

· 生物微機電系統

· 燃料電池

直觀(guān)性強的的軟件提高性能

使用與牛津儀器的值得信賴(lài)的Plasmalab ®產(chǎn)品***族相同的軟件平臺， OpAL的程序驅動(dòng)、多用戶(hù)***別、PC2000TM控制的軟件易于操作且可為快速ALD做相應修改。

Compact open sample loading atomic layer deposition (ALD) system

OpAL provides professional thermal ALD equipment that can be easily upgraded using plasma so that plasma ａnd thermal ALD are integrated in the same compact device.

· open sample loading ALD, integrated plasma technology

· upgrade the site to use plasma

· small to 200mm chips

Thermal and/or plasma chemical products suitable for academic, industrial, research ａnd development use:

Oxides: HfO2, Al2O3, TiO2, SiO2, ZnO, Ta2O5

Nitride: TiN, Si3N4

Metal: Ru, Pt

ALD application examples:

· nano electronics

· high k gate oxides

· high aspect ratio diffusion barrier area between storage capacitor insulation layer ａnd copper wire

· pinhole-free passivation layer for organic light-emitting diodes ａnd polymers

· passivated crystalline silicon solar cells

· high conformal coatings for microfluidics ａnd MEMS applications

· coating of nanopore structure

· biological micro-electromechanical system

· fuel cell

Intuitive software improves performance

Using the same software platform as Oxford instruments＇ trust-worthy Plasmalab ® family of products, OpAL＇s program-driven, multi-user level, PC2000TM controlled software is easy to operate ａnd can be modified for fast ALD.